IPACK2020-2589 Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments

von Krone, Alexis
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IPACK2021-72726 Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

von Carlton, Hayden
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)