IPACK2022-97253 A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

von Deo, Karthik Arun
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)