Application of Electro-Chemical Polishing in DI Water to Cu Damascene Wiring Planarization Process

von Noji, I.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (67 : 2004 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-67.-Shinpojiumu-kōen-ronbunshū (2004)