Preferred Grain Orientation to Enhance Interdiffusion at Room Temperature in Atomic Diffusion Bonding: A Fundamental Study Using Ni and Cu Films

von Uomoto, M.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)

Stress Ratio Effect on Fatigue Crack Initiation Mechanism of Magnesium Alloy AZ31

von Nakai, Y.
Veröffentlicht in International Conference on Processing and Manufacturing of Advanced Materials: Processing, Fabrication, Properties, Applications (11. : 2021 : Wien) THERMEC 2021 ; Part 2 (2021)

Effect of Brightener on Mechanical and Fatigue Properties of Electrodeposited Nanocrystalline Nickel Thin Films

von Nakai, Y.
Veröffentlicht in International Conference on the Mechanical Behaviour of Materials (13. : 2019 : Melbourne) 13th International Conference on the Mechanical Behaviour of Materials 2019 (2020)

Retrograde Teardrop Orbits About Asteroids: Application to the Hayabusa2 Mission

von Kikuchi, S.
Veröffentlicht in AAS/AIAA Space Flight Mechanics Meeting (29. : 2019 : Kaanapali, Hawaii) Spaceflight mechanics 2019 ; Part 2 (2019)

Design and Reconstruction of the Hayabusa2 Precision Landing on Ryugu (AAS 19-762)

von Kikuchi, S.
Veröffentlicht in AAS/AIAA Astrodynamics Specialist Conference (2019 : Portland, Me.) Astrodynamics 2019 ; Part 3 (2020)