IPACK2020-2555 The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods

von Gadhiya, Ghanshyam
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)