IPACK2022-97423 Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate

von Bhandari, Rabin
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)