IPACK2020-2614 PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

von Kaulfersch, A. Otto. E.
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)