IPACK2020-2576 Multifunctional Magnetic Nanocomposite Encapsulant for EMI Shielding in Power Electronics

von Carlton, Hayden
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IPACK2019-6442 Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization

von Whitt, Reece
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2021-72726 Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

von Carlton, Hayden
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)