Adhesive Bonding in Electron Devices

von IKEGAMI, Kozo
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-41.-nenji-taikai (2003)

Effects of Conductive Fillers of Adhesive Resin on Characteristics of Micro Bonded Parts

von KURIBAYASHI, Hideaki
Veröffentlicht in Nihon-Setchaku-Gakkai Kōen-yōshishū, Nihon-Setchaku-Gakkai-46.-nenji-taikai (2008)

Fundamental Study of Adhesive Strength by Using the Butt Type Speecimen of thin Wall Tube. O

von KAMIYA, Koji
Veröffentlicht in Setchaku Kenkyū Happyōkai (15. : 1977 : Tokio) Dai 15kai Setchaku Kenkyū Happyōkai (1977)

Impact Strength of Adhered Cylindrical Butt Joints

von SATO, Chiaki
Veröffentlicht in 34 Nihon Setchaku Gakkai nenji taikai kōen yōshishū (1996)

Adhesive Strength under Combined Stresses State

von IKEGAMI, Kozo
Veröffentlicht in Setchaku Kenkyū Happyōkai (12. : 1974 : Osaka) Dai 12kai Setchaku Kenkyū Happyōkai (1974)

Effect of Surface Roughness and Adhesive Contact Pressure on Adhesive Strength under Combined Stresses

von SUGIBAYASHI, Toshio
Veröffentlicht in Setchaku Kenkyū Happyōkai (15. : 1977 : Tokio) Dai 15kai Setchaku Kenkyū Happyōkai (1977)

Effect of the Biaxial Stresses State and the Thickness of Adhesive Layers on Adhesive Strength

von IKEGAMI, Kozo
Veröffentlicht in Setchaku Kenkyū Happyōkai (13. : 1975 : Tokio) Dai 13kai Setchaku Kenkyū Happyōkai (1975)