Robust Cu Dual-Damascene Interconnect Technology Using High-Diffusive Dopant from Cu-Alloy Seed Layer

von Tonegawa, T.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (68 : 2005 : Kyōto) Handōtai, Shuseki-Kairo-Gijutsu-68.-Shinpojiumu-kōen-ronbunshū (2005)

Examination of Multilevel Interconnect Structure For 65nm-node ULSIs

von Tada, M.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (63 : 2002 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-63.-Shinpojiumu-kōen-ronbunshū (2002)

Highly Reliable Cu/Low-k Dual Damascene Interconnect Technology for 65nm Node

von Ito, F.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (66 : 2004 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-66.-Shinpojiumu-kōen-ronbunshū (2004)