Low Cycle Fatigue Crack Initiation and Propagation Behavior of Copper Thin Films Used in Electronic Devices

von Kambayashi, Tasuku
Veröffentlicht in 2012 2nd IEEE CPMT Symposium Japan (2012)

Prognostic health monitoring method for printed circuit boards subjected to random cyclic loads

von Hirohata, Kenji
Veröffentlicht in 2012 2nd IEEE CPMT Symposium Japan (2012)

IPACK2020-2556 Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

von Kato, Mitsuaki
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

Health Monitoring Method for Load Assessment in Reliability Design of Printed Circuit Board

von Hirohata, Kenji
Veröffentlicht in 2010 IEEE CPMT Symposium Japan (2010)

IPACK2021-69882 Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

von Fumikura,, Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

IMECE2019-10558 Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model

von Kato, Mitsuaki
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2019 : Salt Lake City, Utah) Proceedings of the ASME International Mechanical Engineering Congress and Exposition - 2019 ; Volume 10: Micro- and nano-systems engineering and packaging (2020)

Probabilistic Reliability Analysis Method Based on Surrogate Model for Wind Turbine Drivetrain Structure Subjected to Random Dynamic Load

von Jimbo, Tomohiko
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2022 : Columbus, Ohio) Proceedings of ASME 2022 International Mechanical Engineering Congress and Exposition (IMECE2022) ; Volume 9: Mechanics of solids, structures, and fluids - micro- and nano-systems engineering and packaging - safety engineering, risk, and reliability analysis - research posters (2022)

IMECE2021-70783 Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks

von Kano, Akira
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2021 : Online) Proceedings of ASME 2021 International Mechanical Engineering Congress and Exposition (IMECE 2021) ; Volume 13: Safety engineering, risk, and reliability analysis; research posters (2021)

Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis

von Hisakuni, Yousuke
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2022 : Columbus, Ohio) Proceedings of ASME 2022 International Mechanical Engineering Congress and Exposition (IMECE2022) ; Volume 9: Mechanics of solids, structures, and fluids - micro- and nano-systems engineering and packaging - safety engineering, risk, and reliability analysis - research posters (2022)