An Introduction to the FIB as a Microchip Circuit Edit Tool

von Herschbein, Steven
Veröffentlicht in International Symposium for Testing and Failure Analysis (48. : 2022 : Pasadena, Calif.) 48th International Symposium for Testing and Failure Analysis (ISTFA 2022) ; Volume 2 of 2 (2023)

Building a Better Lab Space for High Tech Imaging/Processing Tools

von Herschbein, Steven B.
Veröffentlicht in International Symposium for Testing and Failure Analysis (48. : 2022 : Pasadena, Calif.) 48th International Symposium for Testing and Failure Analysis (ISTFA 2022) ; Volume 1 of 2 (2023)

Forming Discrete Components on an Integrated Circuit Utilizing Focused lon Beam Direct Write Capabilities

von Winter, Kyle M.
Veröffentlicht in International Symposium for Testing and Failure Analysis (45. : 2019 : Portland, Or.) ISTFA 2019 (2019)