Electronics packaging 3 : at the 214th ECS meeting ; October 12 - 17, 2008, Honolulu, Hawai, USA ; [papers ... presented in the Symposium "Electronics Packaging 3", held during t...

Veröffentlicht 2009

Hydrophilic Bonding of GaN and Diamond Substrates

von Matsumae, T.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)

Gas Absorption in Package Using Au/Pt/Ti Bonding Layer

von Matsumae, T.
Veröffentlicht in Pacific Rim Meeting on Electrochemical and Solid State Science (2020 : Online) (16.) Semiconductor Wafer Bonding: Science, Technology and Applications 16 (2020)

First Evidence for Identification and Accumulation of Protein-Bound and Protein-Free Pyrraline in Human Uremic Plasma by Liquid Chromatography-Mass Spectrometry

von Odani, H.
Veröffentlicht in Nihon Iyō Masu Supekutoru Gakkai Nenkai (21. : 1996 : Osaka) Nihon Iyō Masu Supekutoru Gakkai kōenshū (1996)

Processing materials of 3D interconnects, damascene and electronics packaging 7

Veröffentlicht 2015