Stress Engineering of Multi-Level Interconnection Module with Copper and Low-k Dielectric

von Hasunuma, M.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (64 : 2003 : Osaka) Handōtai, Shuseki-Kairo-Gijutsu-64.-Shinpojiumu-kōen-ronbunshū (2003)

Highly Reliable Low Resistance Cu Contact using Novel CVD Ru/TiN/Ti Stacked Liner

von Kitamura, M.
Veröffentlicht in Handōtai, Shuseki-Kairo-Gijutsu-72.-Shinpojiumu-kōen-ronbunshū (2008)

Reliability Improvement by Adopting Ti-barrier Metal for Porous Low-k ILD Structure

von Sakata, A.
Veröffentlicht in Handōtai, Shuseki-Kairo-Gijutsu-71.-Shinpojiumu-kōen-ronbunshū (2007)

Challenge of Low-k Materials for 65nm Mode Interconnect Technology and Beyond

von Miyajima, H.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (68 : 2005 : Kyōto) Handōtai, Shuseki-Kairo-Gijutsu-68.-Shinpojiumu-kōen-ronbunshū (2005)