IPACK2020-2691 Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging

von Hassan, Rafidh
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)