Effect of Inductively Coupled Electromagnetic Field on Bottom Oxide Etch in a High Aspect Ratio Trench

von Sardo, S.
Veröffentlicht in ECS Meeting (239. : 2021 : Online) (11.) Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 11 (2021)

Layer Configurations for Al-Ge Eutectic Wafer Bonding

von Visker, J.
Veröffentlicht in Pacific Rim Meeting on Electrochemical and Solid State Science (2020 : Online) (16.) Semiconductor Wafer Bonding: Science, Technology and Applications 16 (2020)