Microstructure and Mechanical Properties of SAC-Bi Solder Alloys with Aging

von Hamasha, Sa'd
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)

Effect of Creep and Fatigue on Individual SAC305 Solder Joint Reliability in Iso-thermal Cycling

von Abueed, Mohammed
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)

Evaluating a Hospital Smart Notification System in a Simulated Environment: The Method

von Ali, Haneen
Veröffentlicht in International Conference on Human-Computer Interaction (25. : 2023 : Kopenhagen; Online) HCI International 2023 posters ; Part 2 (2023)

IPACK2019-6563 Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder

von Hasan, S. M. Kamrul
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2019-6567 Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints

von Hoque, Mohd Aminul
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2019-6560 Evolution of the Microstructure of Lead Free Solders Subjected to Bot Aging and Cyclic Loading

von Chowdhury, Md Mahmudur R.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2021-74044 Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

von Hasan, S. M. Kamrul
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

IPACK2018-8414 Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

von Chowdhury, Md Mahmudur R.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

Isothermal Aging Effects and Solder Doping for Harsh Environment Electrical Systems

von Evans, John L.
Veröffentlicht in SMTA Pan Pacific Microelectronics Symposium (27. : 2023 : Koloa, Hawaii) Pan Pacific Microelectronics Symposium 2023 (2023)

SLIR 750: Effects of Matching Lead-free Solder Joints Compared to SnPb on BGA Reliability in Thermal Cycling

von Belhadi, Mohammed
Veröffentlicht in SMTA International Conference (2021 : Minneapolis, Minn.; Online) 2021 SMTA International Conference ; Volume 2 of 2 (2022)

Thermal Cycling Reliability of Newly Developed Lead-Free Solders for Harsh Environments

von Hamasha, Sa'd
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)