Nondestructive Evaruation for Adhesive Bonding

von HIGO, Yakichi
Veröffentlicht in 38.-Nihon-Setchaku-Gakkai-nenji-taikai-kōen-yōshishū (2000)

Influence of packaging on frequency drift in MEMS resonators - Dynamic effect of packaging on MEMS device performance -

von Nishida, Takuma
Veröffentlicht in 2014 IEEE CPMT Symposium Japan (ICSJ 2014) (2014)

Evaluation of the Fixation of Artificial Hip Joint by Acoustic Emission

von GAO, Xiao-Jie
Veröffentlicht in Symposium on Ultrasonic Electronics (10 : 1989 : Tokio) Proceedings of the 10th Symposium on Ultrasonic Electronics (1990)