Quantification Method of Long Term Reliability by Degradation Coefficient and Dispersion Coefficient of Adhesive Strength

von HARAGA, Kosuke
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-40.-nenji-taikai (2002)

Application Expansion of Structural Adhesive Bonding and establishment of it’s Optimization Technology

von HARAGA, Kosuke
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-41.-nenji-taikai (2003)

Study of Linear Analysis Method for The Internal Stress

von HARUNA, Kazushi
Veröffentlicht in Setchaku Kenkyū Happyōkai (32. : 1994 : Tokio) Dai 32kai Setchaku Kenkyū Happyōkai (1994)

Study of Internal Stress in Room Temperature Cured Adhesives - Consideration on the Numerical Analysis for Internal Stress

von HARUNA, Kazushi
Veröffentlicht in Setchaku Kenkyū Happyōkai (31. : 1993 : Tokio) Dai 31kai Setchaku Kenkyū Happyōkai (1993)

Development of Assembly Technique for Panel Encloser with the Combined Use of Adhesive and Rivets

von GANRYU, Yuji
Veröffentlicht in 33 Nihon Setchaku Gakkai nenji taikai kōen yōshishū (1995)

Strength characteristics of adhesive/rivet combined joint

von IMANAKA, Makoto
Veröffentlicht in Setchaku Kenkyū Happyōkai (30. : 1992 : Tokio) Dai 30kai Setchaku Kenkyū Happyōkai (1992)

The Characteristics of Shear Strenght and Viscoelastic Properties of Adhesives

von TERAMOTO, Kazuyoshi
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-40.-nenji-taikai (2002)

Evaluation of Termal Strain onCylindrical Adhesives Bonded Joints

von INABA, Yoshitsugu
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-44.-nenji-taikai (2006)

Strength of Acryl and Epoxy Adhesive Joint

von IMANAKA, Makoto
Veröffentlicht in Setchaku Kenkyū Happyōkai (32. : 1994 : Tokio) Dai 32kai Setchaku Kenkyū Happyōkai (1994)

The Characteristic between Viscoelasticity Properties of TPU and Shear Strenght of Steel/TPU Adhesion

von ONODERA, Tsuyoshi
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-40.-nenji-taikai (2002)

Analysis of Adhesive layer by AC-Impedance Method

von KAWAI, Akira
Veröffentlicht in 38.-Nihon-Setchaku-Gakkai-nenji-taikai-kōen-yōshishū (2000)

Effect of Resin Properties on Thermal Stress of Adhesions - Studying by The 3-D Boundary Element Method

von HARUNA, Kazushi
Veröffentlicht in Setchaku Kenkyū Happyōkai (30. : 1992 : Tokio) Dai 30kai Setchaku Kenkyū Happyōkai (1992)

Adhesive Technology for Fireproof Doors of Elevator

von HARAGA, Kosuke
Veröffentlicht in Kōen-yōshishū, soritsu-40-shūnen-kinen, Nihon-Setchaku-Gakkai-42.-nenji-taikai (2004)

Adhesion Improvement by UV Irradiation on Engineering Prastics

von TERAMOTO, Kazuyoshi
Veröffentlicht in Setchaku Kenkyū Happyōkai (28. : 1990 : Osaka) Dai 28kai Setchaku Kenkyū Happyōkai (1990)

Development and Applications of Structural Adhesive Bonding in Electric and Electronic Equipments

von TAKAGI, Masami
Veröffentlicht in Setchaku Kenkyū Happyōkai (27. : 1989 : Tokio) Dai 27kai Setchaku Kenkyū Happyōkai (1989)

Improvement of Adhesion Properties by Far Ultraviolet Irradiation

von TERAMOTO, Kazuyoshi
Veröffentlicht in Setchaku Kenkyū Happyōkai (29. : 1991 : Nagoya) Dai 29kai Setchaku Kenkyū Happyōkai (1991)