IPACK2021-69270 Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

von Guerrero, Margie
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)