IPACK2022-97428 Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Sircuits

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

IPACK2022-97430 Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

IPACK2020-2680 Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IPACK2021-74063 Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

Process-Performance Interactions and Reliability of SMT Components on Direct-Write and Ink-Jet Circuits Using LTS and ECA Interconnects

von Lall, Pradeep
Veröffentlicht in SMTA Pan Pacific Microelectronics Symposium (27. : 2023 : Koloa, Hawaii) Pan Pacific Microelectronics Symposium 2023 (2023)

IPACK2019-6574 Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2022-97437 Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

IPACK2021-74071 Additively Printed Flexible Temperature Sensor for Wearable Applications

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

Contrastive Attention Networks for Attribution of Early Modern Print

von Vogler, Nikolai
Veröffentlicht in AAAI Conference on Artificial Intelligence (37. : 2023 : Washington, DC; Online) 37th AAAI Conference on Artificial Intelligence (AAAI-23) ; Volume 4, part 2 of 2 (2023)