IPACK2020-2556 Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

von Kato, Mitsuaki
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IMECE2019-10558 Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model

von Kato, Mitsuaki
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2019 : Salt Lake City, Utah) Proceedings of the ASME International Mechanical Engineering Congress and Exposition - 2019 ; Volume 10: Micro- and nano-systems engineering and packaging (2020)