IPACK2019-6507 Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

von Dale, Travis
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)