Atomic layer deposition applications 5 : [Fifth Symposium on Atomic Layer Deposition was held on October 5 till 7, 2009 in Vienna, Austria as part of the 216th meeting of the Ele...

Veröffentlicht 2009

Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding

von Nagano, F.
Veröffentlicht in Pacific Rim Meeting on Electrochemical and Solid State Science (2020 : Online) (16.) Semiconductor Wafer Bonding: Science, Technology and Applications 16 (2020)

Surface Chemistry and Nanoscale Wet Etching of Group IV Semiconductors in Acidic H2O2 Solutions

von Dorp, D. H. van
Veröffentlicht in International Symposium on Ultra Clean Processing of Semiconductor Surfaces (15. : 2021 : Mecheln) Ultra clean processing of semiconductor surfaces XV (2021)

Characteristics of PVD-HfO2 with Poly-Si and Fully Silicided Gates

von Hayashi, S.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (68 : 2005 : Kyōto) Handōtai, Shuseki-Kairo-Gijutsu-68.-Shinpojiumu-kōen-ronbunshū (2005)

Atomic layer deposition applications 11

Veröffentlicht 2015

Integrating Hf-based high-k gate stacks with polysilicon gates

von Gendt, S. De
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (64 : 2003 : Osaka) Handōtai, Shuseki-Kairo-Gijutsu-64.-Shinpojiumu-kōen-ronbunshū (2003)

Atomic layer deposition applications 10

Veröffentlicht 2014