IPACK2019-6356 Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins

von Nakamura, Yuta
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2021-70410 Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam

von Kawakita, Shinya
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

IPACK2019-6396 Prediction and Control Technique of the Paper Media Temperature After Fusing in Electrophotographic Process

von Kawasaki, Shunsuke
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)