A Novel Cylinder-Type Metal-Insulator-Metal Capacitor in Porous Low-k Film for Embedded DRAM with Advanced CMOS Logics

von Hijioka, K.
Veröffentlicht in Handōtai, Shuseki-Kairo-Gijutsu-75.-Shinpojiumu-kōen-ronbunshū (2011)

Examination of Multilevel Interconnect Structure For 65nm-node ULSIs

von Tada, M.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (63 : 2002 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-63.-Shinpojiumu-kōen-ronbunshū (2002)

BEOL-FET technology for on-chip voltage-bridging l/Os

von Sunamura, H.
Veröffentlicht in Handōtai, Shuseki Kairo Gijutsu dai 77-kai Shinpojiumu kōen ronbunshū (2013)

Highly Reliable Cu/Low-k Dual Damascene Interconnect Technology for 65nm Node

von Ito, F.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (66 : 2004 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-66.-Shinpojiumu-kōen-ronbunshū (2004)