IPACK2021-69882 Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

von Fumikura,, Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)