Ultra-Thinning of Silicon for Backside Fault Isolation

von Campin, M. J.
Veröffentlicht in International Symposium for Testing and Failure Analysis (45. : 2019 : Portland, Or.) ISTFA 2019 (2019)

An Innovative Technique for Large-Scale Delayering of Semiconductor Devices with Nanometric-Scale Surface Flatness

von Nowakowski, P.
Veröffentlicht in International Symposium for Testing and Failure Analysis (48. : 2022 : Pasadena, Calif.) 48th International Symposium for Testing and Failure Analysis (ISTFA 2022) ; Volume 1 of 2 (2023)

High Throughput and Multiple Length Scale Sample Preparation for Characterization and Failure Analysis of Advanced Semiconductor Devices

von Bonifacio, C. S.
Veröffentlicht in International Symposium for Testing and Failure Analysis (45. : 2019 : Portland, Or.) ISTFA 2019 (2019)