IMECE2019-11181 Packaging Challenges of Thin High Bandwidth POP

von Tung, Fletcher (Cheng-Piao)
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2019 : Salt Lake City, Utah) Proceedings of the ASME International Mechanical Engineering Congress and Exposition - 2019 ; Volume 10: Micro- and nano-systems engineering and packaging (2020)