Corruption and inflation

von Marhubi, Fahim Abdula al-
Veröffentlicht in Economics letters (2000)

Determinants of exchange rate choice

von Marhubi, Fahim Abdula al-
Veröffentlicht 1994

A note on the link between income inequality and inflation

von Marhubi, Fahim Abdula al-
Veröffentlicht in Economics letters (1997)

Openess and governance : evidence across countries

von Marhubi, Fahim Abdula al-
Veröffentlicht in Oxford development studies (2005)

Income inequality and inflation : the cross-country evidence

von Marhubi, Fahim Abdula al-
Veröffentlicht in Contemporary economic policy (2000)

Cross-country evidence on the link between inflation volatility and growth

von Marhubi, Fahim Abdula al-
Veröffentlicht in Applied economics (1998)

The Determinants of governance : a cross-country analysis

von Marhubi, Fahim Abdula al-
Veröffentlicht in Contemporary economic policy (2004)

Currency policies for inflation control in the formerly centrally planned economies

von Willett, Thomas D.
Veröffentlicht in The world economy (1994)

Currency policies for inflation control in the formerly centrally planned economies

von Willett, Thomas D.
Veröffentlicht in The world economy (1994)

The anti inflationary influence of corporatist structures and central bank independence : the importance of the hump shaped hypothesis

von Marhubi, Fahim Abdula al-
Veröffentlicht in Public choice (1995)

IPACK2018-8408 Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

von Fahim, Abdullah
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2020-2655 Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading

von Fahim, Abdullah
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IPACK2020-2693 Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling

von Hasan, S. M. Kamrul
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IPACK2019-6471 Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading

von Fahim, Abdullah
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2020-2694 Deformation Behavior of SAC305 Solder Joints With Multiple Grains

von Mondal, Debabrata
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IPACK2019-6563 Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder

von Hasan, S. M. Kamrul
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

Solder-joint Reliability of a 0.65mm Pitch Molded Array Package for Automotive Applications

von Carpenter, Burton
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)

IPACK2018-8414 Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

von Chowdhury, Md Mahmudur R.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2021-74044 Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

von Hasan, S. M. Kamrul
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)