Thermoelectrical Characterization of Piezoelectric Diaphragms: Towards a Better Understanding of Ferroelectrics for Future Memory Applications

von Vinuesa, G.
Veröffentlicht in ECS Meeting (239. : 2021 : Online) (11.) Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 11 (2021)

Performance Assessment of Amorphous HfO2-Based RRAM Devices for Neuromorphic Applications

von Ossorio, O. G.
Veröffentlicht in ECS Meeting (239. : 2021 : Online) (11.) Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 11 (2021)