Ultra-Precision Polishing and It’s Applications to the Planalrzation CMP Technology Towards Realization of Cu Wiring/Low-k Interlevel Dielecetrie Layer CMP

von Doy, T. Karaki
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (58 : 2000 : Tokio) 58.-Handōtai-Shuseki-Kairo-Gijutsu-Shinpojiumu-kōen-ronbunshū (2000)