IPACK2018-8256 Analysis of Thermal Properties of Power Multifinger HEMT Devices

von Chvála, Aleš
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

Conference proceedings / Second International Conference on Advanced Semiconductor Devices and Microsystems : Smolenice Castle, 5 - 7 October 1998

Veröffentlicht 1998