Growth models of copper filling in through silicon via at different current density

von Wang, Zhaoyu
Veröffentlicht in 2013 IEEE CPMT Symposium Japan (formerly VLSI Packaging Workshop of Japan) (2013)

Study of mechanical properties of Cu specimen using through-silicon-vias (TSV) electrodeposition bath

von Wang, Huiying
Veröffentlicht in 2013 IEEE CPMT Symposium Japan (formerly VLSI Packaging Workshop of Japan) (2013)

Recent progress in through silicon vias (TSVs): Cu filling, microstructure characterization and mechanical properties

von Cheng, Ping
Veröffentlicht in 2013 IEEE CPMT Symposium Japan (formerly VLSI Packaging Workshop of Japan) (2013)