Reliability Assessment of BGA Solder Joints - Megtron 6 VS FR4 Printed Circuit Boards

von Chowdhury, Raufur
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)

Mechanical Failure of Thermal Interface Materials Due to Thermal Aging and Impact on Performance of Electronic Package

von Chauhan, Tushar
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)