IPACK2018-8337 On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

von Chowdhury, Piyas
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)