IPACK2019-6567 Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints

von Hoque, Mohd Aminul
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2019-6560 Evolution of the Microstructure of Lead Free Solders Subjected to Bot Aging and Cyclic Loading

von Chowdhury, Md Mahmudur R.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2018-8414 Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

von Chowdhury, Md Mahmudur R.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)