IPACK2020-2547 High Performance Computing Package With Chip Module on Substrate Solutions

von Chen, Ching Chia
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)