IPACK2019-6416 Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

von Pense, Dustin
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

Monitoring Perfusion-Based Convection in Cancer Tumor Tissue Undergoing Nanoparticle Heating by Analyzing Temperature Responses to Transient Pulsed Heating

von Carlton, Hayden
Veröffentlicht in ASME Summer Heat Transfer Conference (2023 : Washington, DC) Proceedings of ASME 2023 Heat Transfer Summer Conference (HT 2023) (2023)

IPACK2020-2576 Multifunctional Magnetic Nanocomposite Encapsulant for EMI Shielding in Power Electronics

von Carlton, Hayden
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IPACK2021-72726 Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

von Carlton, Hayden
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)