IPACK2022-97400 Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling

von Kisitu, Deogratius
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

]PACK2022-97421 Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model

von Ortega, Alfonso
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

IPACK2022-97047 Direct-to--ChipTwo-Phase Cooling for High Heat Flux Processors

von Heydari, Ali
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)