IPACK2018-8279 Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

von Echeverría, Marco J.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2019-6385 Metallic PCM's Microstructural Stability Under Repetitive Melting/Solidification Cycles

von Baez, Rafael
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2018-8355 Multifunctional Chip for Use in Thermal Analysis of Power Systems

von Gonzalez-Nino, David
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2019-6559 Advanced Packaging and Thermal Management of High-Power DC-DC Converters

von Yuruker, Sevket U.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)