IPACK2022-97481 Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling

von Herring, Joseph
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

IPACK2022-97423 Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate

von Bhandari, Rabin
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

Mechanical Failure of Thermal Interface Materials Due to Thermal Aging and Impact on Performance of Electronic Package

von Chauhan, Tushar
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)