A geometric characterization of a class of modular representations

von Assadi, Amir H.
Veröffentlicht 1988

Finite group actions on simply-connected manifolds and CW complexes

von Asadī, Amīr H.
Veröffentlicht 1982

An algebraic variation on a theorem of atiyah-bott

von Assadi, Amir H.
Veröffentlicht 1988

Taḥdīr al-ẖalaf mimmā fi 't-tilfāz min at-talaf

von Asadī, ʿĀmir al-
Veröffentlicht 1994

Finite group actions on simply-connected manifolds and CW complexes

von Assadi, Amir H.
Veröffentlicht 1982

A Novel, Scalable Production of Multifunctional Nanocomposite Polymer Filaments for Additive Manufacturing (109)

von CARROLA, MIA
Veröffentlicht in American Society for Composites (36. : 2021 : Online) Composites ingenuity taking on challenges in environment - energy - economy ; Volume 1 of 4 (2021)

CELLULOSE NANOCRYSTALS ASSISTED PROCESS TO INTEGRATE CARBON NANOTUBES IN CFRP COMPOSITES

von Kumar, Annuatha
Veröffentlicht in AIAA SciTech Forum and Exposition (2020 : Orlando, Fla.) Materials (2020)

Interfacial Properties of Hybrid Cellulose Nanocrystal/Carbonaceous Nanomaterial Composites (305)

von KAYNAN, OZGE
Veröffentlicht in American Society for Composites (36. : 2021 : Online) Composites ingenuity taking on challenges in environment - energy - economy ; Volume 4 of 4 (2021)

In-Situ Bending Performance of Nanostructured Carbon Fiber Reinforced Polymer Composites

von Kaynan, Ozge
Veröffentlicht in American Society for Composites (37. : 2022 : Tucson, Ariz.) 37th Technical Conference of the American Society for Composites 2022 ; Volume 3 of 3 (2022)

Damage Detection of CNT/CNC-Reinforced Foam-Cored Sandwich Composites by Acoustic Emission Tests Under Flexural Load

von Kucukkalfa, Eyuphan
Veröffentlicht in AIAA SciTech Forum (2023 : National Harbor, Md.; Online) Materials ; Volume 2 of 2 (2023)

IPACK2019-6434 Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

von Tayyara, Omri
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)