IPACK2019-6413 Thermoreflectance Imaging of Electromigration in Aluminium Interconnects at Different Ambient Temperatures

von Alajlouni, Sami
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)