IPACK2019-6521 Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

von Ahmed, Tusher
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)